BGA Reballing Stencil Template Stainless Steel Portable High Temperature Resistant Reballing Rework

Feature: 1. [APPLICABLE MODEL] This stainless steel BGA reballing template is very useful for mate 40 series with for Kirin 9000 CPU. 2. [SEMI CARVING PROCESS] The semi engraving process is used to provide multiple IC slots on the main body of the stencil, effectively preventing small ICs from sticking to the tin and ensuring that small ICs do not break the corners. 3. [STAINLESS STEEL] This rework net is made of stainless steel, hard and wear resistant and not easy to deformation, long life. 4. [HIGH TEMPERATURE RESISTANT] This BGA reballing template is very durable as it is heat resistant and does not change shape at high temperatures. 5. [ACCURATE POSITIONING] This tinsel net can achieve precise positioning and can effectively and quickly help you to complete your cell phone repair work. Specification: Item Type: BGA Reballing Stencil Template Material: Stainless steel Steel Mesh Thickness: 0.12mm Applicable CPU: For Kirin 9000(hi36A0) Applicable Product Models: For mate 40, for mate 40 Pro, for mate 40 Pro+, for mate 40 RS . Package List: 1 x BGA Reballing Stencil Template [APPLICABLE MODEL] This stainless steel BGA reballing template is very useful for mate 40 series with for Kirin 9000 CPU. [SEMI CARVING PROCESS] The semi engraving process is used to provide multiple IC slots on the main body of the stencil, effectively preventing small ICs from sticking to the tin and ensuring that small ICs do not break the corners. [STAINLESS STEEL] This rework net is made of stainless steel, hard and wear resistant and not easy to deformation, long life. [HIGH TEMPERATURE RESISTANT] This BGA reballing template is very durable as it is heat resistant and does not change shape at high temperatures. [ACCURATE POSITIONING] This tinsel net can achieve precise positioning and can effectively and quickly help you to complete your cell phone repair work.